How to choose the good wave solder pallet material for PCB soldering



To choose the good wave solder pallet material usually need consider following facts.
1. Good flatness and strength
2. Easy to machining, not hurt the cutters
3. Can work under high temperature at least 260 centi-degrees for long time
4. Repeat work times not less than 10000
6. Lead-free
7. Made by heavy automatic hydraulic stamping press machines
Energetic Industry wave solder pallet material give flatness at ±0.10mm, compressive strength ≥ 340~510 Mpa, easy for machining, long time work temperature ≥280 centi-degrees, max short work temperature 410 centi-degrees, 12000 work times, 100% lead free, Rohs approved, 3500 tons automatic hydraulic stamping press machines made.
  • Stock Color: Black, grey for customized
  • Thickness: 2mm ~ 50mm
  • Size: 1020mmx1220mm, 1220mmx2440mm
More information please visit our web site and email us.

评论

发表评论

此博客中的热门博文

How to deal with the problem of fusion line?

图片
Reason analysis: From the perspective of plastics, the melting line is essentially caused by the incomplete melting of two plastic flow fronts. Solution: To eliminate or reduce the melting line, plastics must have low viscosity, high temperature, sufficient pressure and enough time to melt completely. Usually, in the case of good exhaust, accelerating the filling and feeding speed and increasing the pressure as soon as possible after the combination of two plastic flow fronts will help to solve the melting line problem.
阅读全文

How to solve the problem of surface depression?

图片
Basic Reasons : From the perspective of plastics, when the plastics are cooled and contracted, insufficient feeding will lead to dents on the external surface or holes in the interior of the products. Depression occurs in different locations, and the causes and solutions of the defects are also different. 1. When the depression occurs at the final cooling position of the thick-walled product or at a distance from the gate: Cause analysis: Typical surface depressions or voids at the thick wall and far away from the gate are usually due to the increase of effective viscosity and pressure loss, resulting in insufficient cavity pressure, resulting in insufficient feeding pressure. Solution: Increase the pressure of feeding and speed up the feeding rate 2. Surface depressions or cavitations occur near the gate Cause analysis: Depression occurs near gate, usually due to lack of gate freezing. There are several reasons affecting gate freezing: it may be caused by the decrease of ef...
阅读全文

Analysis of Common Defects in Plastic Products-Size Change

Basic Reasons: From the perspective of plastics, the reasons for the size change are as follows: The change of pressure distribution in U-shaped cavity will cause the change of size. For crystalline plastics, the change of crystallinity due to the change of cooling rate will cause the change of size. After-treatment of U products, changes in ambient temperature and humidity can also cause size changes. Next, the change of pressure distribution in the cavity and the size change are analyzed and discussed. The causes of defects will vary with the size changes. First, defect phenomenon: the overall product size is too small. Cause analysis: the plastic pressure in the cavity is too low. Solution: Increase the feeding pressure to meet the cavity pressure required by qualified products. 2. Defects: Overall product size is too large Cause analysis: the plastic pressure in the cavity is too high. Solution: Reduce the feeding pressure to achieve the cavity pressure require...
阅读全文